Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09848137
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Filing Dt:
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05/03/2001
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Publication #:
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Pub Dt:
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11/21/2002
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Inventors:
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Tzong Da Ho, Chien Ping Huang
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Title:
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Thermally enhanced wafer-level chip scale package and method of fabricating the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3 DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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| DIKE, BRONSTEIN, ROBERTS & CUSHMAN |
| PETER F. CORLESS |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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