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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09873059
Filing Dt:
06/02/2001
Publication #:
Pub Dt:
12/05/2002
Inventor:
Kenneth R. Philpot
Title:
Enhanced performance surface mount semiconductor package devices and methods
Assignment: 1
Reel/Frame:
013260/0992Recorded: 09/03/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/21/2002
Assignee:
2381 MORSE AVENUE
IRVINE, CALIFORNIA 92614
Correspondent:
MICROSEMI CORPORATION
MICHAEL A. SILEO, JR.
8131 LBJ FREEWAY, SUITE 800
DALLAS, TX 75251-1333

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