Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09872264
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Filing Dt:
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06/01/2001
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Publication #:
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Pub Dt:
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12/05/2002
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Inventors:
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Chih-Wen Lin, Chen-Jung Tsai, Jui-Chung Lee
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Title:
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Three-dimension multi-chip stack package technology
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 16, LI-HSIN RD. |
HSIN-CHU CITY, TAIWAN R.O.C |
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POWELL, GOLDSTEIN, FRAZER & MURPHY LLP |
THOMAS T. MOGA |
P.O. BOX 97223 |
WASHINGTON, D.C. 20090-7223 |
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