Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/23/2004
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Application #:
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09880518
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Filing Dt:
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06/12/2001
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Publication #:
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Pub Dt:
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12/05/2002
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Inventor:
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Kun-Chih Wang
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Title:
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BONDING PAD STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN RD. II |
| HSINCHU, TAIWAN R.O.C |
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| CHARLES C.H. WU & ASSOCIATES |
| CHARLES C.H. WU |
| 7700 IRVINE CENTER DRIVE, SUITE 710 |
| IRVINE, CA 92618-3043 |
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