Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10047228
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Filing Dt:
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01/14/2002
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Publication #:
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Pub Dt:
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12/05/2002
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Inventors:
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Spring Liu, Flanko Lee, Mars Lin
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Title:
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Heat dissipating structure of webpad
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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INVENTEC BLDG., 66 HOU-KANG ST. |
SHIH-LIN DISTRICT, TAIPEI, TAIWAN R.O.C |
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EDWARDS & ANGELL, LLP |
PETER F. CORLESS |
P.O. BOX 9169 |
BOSTON, MA 02209 |
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