Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09952651
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Filing Dt:
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09/13/2001
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Publication #:
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Pub Dt:
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12/05/2002
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Inventor:
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Han-Ping Pu
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Title:
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Method for connecting semiconductor unit to object via bump
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG RD. |
| TANTZU TAICHUNG,, TAIWAN R.O.C |
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| KLARQUIST SPARKMAN, LLP |
| STACEY C. SLATER |
| ONE WORLD TRADE CENTER, SUITE 1600 |
| 121 S.W. SALMON STREET |
| PORTLAND, OREGON 97204-2988 |
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