Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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09879875
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Filing Dt:
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06/11/2001
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Publication #:
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Pub Dt:
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12/12/2002
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Inventors:
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Abu K. Eghan, Lan H. Hoang
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Title:
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HIGH PERFORMANCE FLIPCHIP PACKAGE THAT INCORPORATES HEAT REMOVAL WITH MINIMAL THERMAL MISMATCH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2100 LOGIC DRIVE |
SAN JOSE, CALIFORNIA 95124 |
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XILINX, INC. |
EDEL M. YOUNG |
2100 LOGIC DR. |
SAN JOSE, CA 95124 |
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