Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/21/2004
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Application #:
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09815998
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Filing Dt:
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03/22/2001
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Publication #:
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Pub Dt:
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12/12/2002
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Inventors:
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Chun-Min Chuang, I-Liang Lin, Chun-Kuang Lin, Yung-I Yeh
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Title:
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SYSTEM FOR PROVIDING IC BONDING DIAGRAM VIA NETWORK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NANTZE EXPORT PROCESSING ZONE |
| 26, CHIN 3RD ROAD |
| KAOHSIUNG, TAIWAN ROC |
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| BLAKELY SOKOLOFF TAYLOR & ZAFMAN, LLP |
| CHUN M. NG |
| 12400 WILSHIRE BLVD. |
| 7TH FLOOR |
| LOS ANGELES, CALIFORNIA 90025 |
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