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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09882696
Filing Dt:
06/15/2001
Publication #:
20020192948
Pub Dt:
12/19/2002
Inventors:
Fusen Chen, Ling Chen, Gongda Yao, Ming Xi, Hyungsuk Alexander Yoon, Barry Chin, Mei Chang et al
Title:
Integrated barrier layer structure for copper contact level metallization
Assignment: 1
Reel/Frame:
011920/0001Recorded: 06/15/2001Pages: 29
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, FUSEN
Exec Dt:
06/04/2001
CHEN, LING
Exec Dt:
06/07/2001
YAO, GONGDA
Exec Dt:
06/05/2001
XI, MING
Exec Dt:
06/06/2001
CHIN, BARRY
Exec Dt:
06/14/2001
CHANG, MEI
Exec Dt:
06/05/2001
GANGULI, SESHADRI
Exec Dt:
06/04/2001
YANG, MICHAEL X.
Exec Dt:
06/04/2001
YOON, HYUNGSUK ALEXANDER
Exec Dt:
06/04/2001
Assignee:
APPLIED MATERIALS, INC.
P.O. BOX 450A
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
APPLIED MATERIALS, INC.
ROBERT W. MULCAHY
P.O. BOX 450A
SANTA CLARA, CA 95052

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