Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/13/2005
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Application #:
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10163082
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Filing Dt:
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06/05/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Inventors:
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Tsung-Kuan A. Chou, Khalil Najafi, Luis P. Bernal, Peter D. Washabaugh
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Title:
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LOW-TEMPERATURE PATTERNED WAFER BONDING WITH PHOTOSENSITIVE BENZOCYCLOBUTENE (BCB) AND 3D MEMS (MICROELECTROMECHANICAL SYSTEMS) STRUCTURE FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3003 SOUTH STATE STREET |
A CONSTITUTIONAL CORPORATION OF THE STATE OF MICHIGAN |
ANN ARBOR, MICHIGAN 48109 |
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HARNESS, DICKEY & PIERCE P.L.C. |
STANLEY M. ERJAVAC |
P.O. BOX 828 |
BLOOMFIELD HILLS, MI 48303 |
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