Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10091945
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Filing Dt:
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03/05/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Inventors:
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Chun-Chi Lee, Jaw-Shiun Hsieh, Yu-Hsien Lin, Yao-Hsin Feng, Hou-Chang Kuo, Kuan-Neng Liao
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Title:
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Cavity down ball grid array packaging structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| EXPORT PROCESSING ZONE |
| 26, CHIN 3RD. RD., 811, NANTZE |
| KAOHSIUNG, TAIWAN R.O.C |
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| J.C. PATENTS, INC. |
| JIAWEI HUANG |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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