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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09887444
Filing Dt:
06/25/2001
Publication #:
Pub Dt:
12/26/2002
Inventor:
Daniel Collette
Title:
Bond pad structure
Assignment: 1
Reel/Frame:
011950/0139Recorded: 06/25/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/01/2001
Assignee:
GROENEWOUDSEWEG 1
5621 BA EINDHOVE THE, NETHERLANDS
Correspondent:
LACASSE & ASSOCIATES
RANDY W. LACASSE
2001 JEFFERSON DAVIS HIGHWAY, SUITE 806
ARLINGTON, VIRGINIA 22202

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