Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09987497
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Filing Dt:
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11/15/2001
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Publication #:
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Pub Dt:
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01/09/2003
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Inventors:
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Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chia-Chieh Hu, Wen-Long Leu et al
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Title:
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Method and device for making a metal bump with an increased height
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| N.E.P.Z. |
| 9, CHUNG-SAN STREET |
| KAOHSIUNG, TAIWAN |
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| WEN LO SHIEH |
| PO BOX 82-144 |
| TAIPEI, TAIWAN |
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