Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/25/2003
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Application #:
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10189731
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Filing Dt:
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07/03/2002
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Publication #:
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Pub Dt:
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01/16/2003
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Inventor:
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Stephen J. Burden
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Title:
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SEMICONDUCTOR WAFERS WITH INTEGRATED HEAT SPREADING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5906 MCINTYRE STREET |
| GOLDEN, COLORADO 80403 |
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| SHERIDAN ROSS P.C. |
| ROBERT D. TRAVER |
| 1560 BROADWAY |
| STE. 1200 |
| DENVER, CO 80202-5141 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 530 EAST CENTRAL BLVD. |
| SUITE 1601 |
| ORLANDO, FLORIDA 32801 |
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| MEGAN D. DORTENZO |
| 127 PUBLIC SQUARE |
| 3900 KEY CENTER |
| CLEVELAND, OH 44114 |
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