Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09910053
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Filing Dt:
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07/23/2001
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Publication #:
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Pub Dt:
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01/23/2003
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Inventor:
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Chih-Yu Ting
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Title:
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Structure of a chip package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F-5, NO. 6, LANE 609, CHUNG HSING RD., SEC. 5 |
| SANCHUNG CITY, TAIWAN |
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| CHIH-YU TING |
| PO BOX 82-144 |
| TAIPEI, TAIWAN |
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