Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10205323
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Filing Dt:
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07/25/2002
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Publication #:
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Pub Dt:
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02/20/2003
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Inventors:
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Gorou Ikegami, Taro Hirai
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Title:
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Printed circuit board having plating conductive layer with bumps and its manufacturing method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| KATTEN MUCHIN ZAVIS ROSENMAN |
| MICHAEL I. MARKOWITZ |
| 15TH FL. IP DEPT., 575 MADISON AVENNUE |
| NEW YORK, NY 10022-2585 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE |
| NAKAHARA-KU, KAWASAKI |
| KANAGAWA 211-8668, JAPAN |
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| KATTEN MUCHIN ZAVIS ET AL. |
| MICHAEL I. MARKOWITZ |
| 575 MADISON AVENUE |
| IP DEPARTMENT 15TH FL. |
| NEW YORK, NY 10022-2585 |
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