Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10227089
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Filing Dt:
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08/23/2002
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Publication #:
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Pub Dt:
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02/27/2003
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Inventors:
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William Devereux Palmer, Salvatore Bonafede, Dorota Temple, Brian Stoner
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Title:
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Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3021 CORNWALLIS ROAD |
P.O. BOX 12889 |
RESEARCH TRIANGLE PARK, NORTH CAROLINA 27709-2889 |
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ALSTON & BIRD LLP |
JAMES C. EDWARDS |
101 SOUTH TRYON STREET |
BANK OF AMERICA PLAZA, SUITE 4000 |
CHARLOTTE, NC 28280-4000 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3021 CORNWALLIS ROAD |
RESEARCH TRIANGLE PARK, NORTH CAROLINA 27709 |
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OBLON, SPIVAK, MCCLELLAND, MAIER, ET AL |
1940 DUKE STREET |
ALEXANDRIA, VIRGINIA 22314 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3040 CORNWALLIS ROAD |
RESEARCH TRIANGLE PARK, NORTH CAROLINA 27709 |
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OBLON, SPIVAK, MCCLELLAND, MAIER, ET AL |
1940 DUKE STREET |
ALEXANDRIA, VIRGINIA 22314 |
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09/21/2024 03:16 PM
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