Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10085725
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Filing Dt:
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02/28/2002
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Publication #:
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Pub Dt:
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03/06/2003
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Inventors:
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Toshihito Tsuga, Minoru Fube, Kazutaka Nakayama
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Title:
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Method and device for removing particles on semiconductor wafers
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 6557474, M.S. 3999 |
| DALLAS, TEXAS 75265 |
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| TEXAS INSTRUMENTS INCORPORATED |
| JACQUELINE J. GARNER |
| P.O. BOX 655474, M.S. 3999 |
| DALLAS, TX 75265 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SINFORIANO MADRONERO, 24 |
| BADAJOZ, SPAIN 06011 |
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| WILLIAM L. ANDROLIA |
| QUINN EMANUEL URQUHART OLIVER |
| & HEDGES, LLP KODA/ANDROLIA |
| 865 SOUTH FIGUEROA STREET, 10TH FLOOR |
| LOS ANGELES, CA 90017 |
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