Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10051248
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Filing Dt:
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01/18/2002
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Publication #:
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Pub Dt:
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03/20/2003
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Inventors:
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Yoshinari Matsuda, Ikuo Jimmy Sanwo, Mahyer Nejat
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Title:
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Method of improving mount assembly in a multilayer PCB's
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-35 KITASHINAGAWA 6-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN |
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| 1 SONY DRIVE |
| PARK RIDGE, NEW JERSEY 07656 |
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| SONY ELECTRONICS INC. |
| CARRIE MERZBACHER |
| INTELLECTUAL PROPERTY DEPT., MZ7190 |
| 16450 WEST BERNARDO DRIVE |
| SAN DIEGO, CA 92127-1898 |
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