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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/30/2004
Application #:
10156630
Filing Dt:
05/28/2002
Publication #:
Pub Dt:
03/27/2003
Inventors:
Chwan-Ying Lee, Tzuen-Hsi Huang
Title:
METHOD OF ELECTROLESS PLATING COPPER ON NITRIDE BARRIER
Assignment: 1
Reel/Frame:
034349/0612Recorded: 12/03/2014Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/20/2014
Assignee:
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
3100 INTERSTATE NORTH CIRCLE
SUITE 150
ATLANTA, GA 30339

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