Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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12/12/2006
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Application #:
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10159965
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Filing Dt:
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05/30/2002
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Publication #:
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Pub Dt:
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04/17/2003
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Inventors:
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Leung Tsang, Houfei Chen, Chungchi Huang, Vikram Jandhyala
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Title:
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METHODS FOR MODELING INTERACTIONS BETWEEN MASSIVELY COUPLED MULTIPLE VIAS IN MULTILAYERED ELECTRONIC PACKAGING STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LAW OFFICES OF RONALD M. ANDERSON |
| RONALD M. ANDERSON |
| 600-108TH AVENUE N.E. |
| SUITE 507 |
| BELLEVUE, WA 98004 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LAW OFFICES OF RONALD M. ANDERSON |
| RONALD M. ANDERSON |
| 600-108TH AVENUE, N.E., STE. 507 |
| BELLEVUE, WA 98004 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LAW OFFICES OF RONALD M. ANDERSON |
| RONALD M. ANDERSON |
| 600 - 108TH AVE., NE, STE. 507 |
| BELLEVUE, WA 98004 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LAW OFFICES OF RONALD M. ANDERSON |
| 600-108TH AVE. N.E. |
| STE. 507 |
| BELLEVUE, WA 98004 |
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