Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/29/2004
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Application #:
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10232344
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Filing Dt:
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08/30/2002
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Publication #:
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Pub Dt:
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05/01/2003
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Inventors:
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Joong-Hyun Baek, Ho-Jeong Moon, Dong-Kil Shin, Yun-Hyeok Im
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Title:
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SEMICONDUCTOR PACKAGE HAVING THERMAL INTERFACE MATERIAL (TIM)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 16, BANWOI, RI, TAEAN-EUB, HWASUNG-CITY |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| ALAN T. MCCOLLOM |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OREGON 97205 |
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