Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/21/2004
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Application #:
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10203360
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Filing Dt:
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08/07/2002
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Publication #:
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Pub Dt:
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05/08/2003
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Inventors:
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Masanori Ogawa, Seinosuke Horiki, Takehiko Kajita, Kuninori Itou
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Title:
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RESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED OBJECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 213-5 HONOWARI |
| MINAMISHIBATA-CHO, TOKAI-SHI |
| AICHI, JAPAN |
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| COOPER & DUNHAM LLP |
| DONALD S. DOWDEN |
| 1185 AVENUE OF THE AMERICAS |
| 23RD FLOOR |
| NEW YORK, NY 10036 |
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