Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10035518
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Filing Dt:
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11/09/2001
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Publication #:
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Pub Dt:
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05/15/2003
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Inventors:
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Vincent K. Chan, Sam Ho, Chi-Shung David Wang, Gregory C. Buchner
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Title:
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Direct interconnect multi-chip module, method for making the same and electronic package comprising same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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33 COMMERCE VALLEY DRIVE EAST |
THORNHILL, ONTARIO, CANADA L3T 7 |
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SIMON, GALASSO, FRANTZ, PLC |
J. GUSTAV LARSON |
P.O. BOX 26503 |
AUSTIN, TX 78755-0503 |
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