Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2005
|
Application #:
|
10282637
|
Filing Dt:
|
10/29/2002
|
|
Publication #:
|
|
Pub Dt:
|
05/22/2003
| | | | |
|
Inventor:
|
Jen-Kuang Fang
|
|
Title:
|
Multi-chip module packaging device using flip-chip bonding technology
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 26 CHIN 3RD ROAD |
| NANTZE EXPORT PROCESSING ZONE KAOSHIUNG |
| KAOSHIUNG, TAIWAN R.O.C. |
|
|
|
|
| HAROLD V. STOTLAND |
| SEYFARTH SHAW |
| 55 EAST MONROE STREET SUITE 4200 |
| CHICAGO, LLLINOIS 60603-5803 |
|
|
Search Results as of:
09/23/2024 06:41 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
