Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10213644
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Filing Dt:
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08/07/2002
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Publication #:
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Pub Dt:
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06/05/2003
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Inventors:
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Toshihisa Shimo, Toshiki Inoue, Kyoko Kumagai, Yoshifumi Kato, Takashi Yoshida et al
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Title:
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Method of copper plating via holes
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, TOYODA-CHO |
| KARIYA-SHI, AICHI-KEN, JAPAN |
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| MORGAN & FINNEGAN, L.L.P. |
| STEVEN F. MEYER |
| 345 PARK AVENUE |
| NEW YORK, NY 10154-0053 |
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