Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10006125
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Filing Dt:
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12/10/2001
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Publication #:
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Pub Dt:
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06/12/2003
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Inventor:
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Tse Ying Liu
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Title:
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Pin lamination method that may eliminate pits and dents formed in a multi-layer printed wiring board and the ply-up device thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SHIN CHUANG VILLAGE, LU CHU HSIANG |
| 91 LANE 814 TA-HSIN RD. |
| TAOYUAN HSIEN, TAIWAN R.O.C |
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| ROSENBERG, KLEIN & LEE |
| MORTON J. ROSENBERG |
| 3458 ELLICOTT CENTER DRIVE |
| SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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