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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
09940249
Filing Dt:
08/27/2001
Publication #:
Pub Dt:
06/12/2003
Inventors:
Yoshihiro Ono, Takehiko Maeda
Title:
Resin encapsulated BGA-type semiconductor device
Assignment: 1
Reel/Frame:
012130/0413Recorded: 08/27/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/23/2001
Exec Dt:
08/23/2001
Assignee:
7-1, SHIBA 5-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
HAYES, SOLOWAY, HENNESSEY, ET AL
NORMAN P. SOLOWAY
175 CANAL STREET
MANCHESTER, NH 03101
Assignment: 2
Reel/Frame:
012417/0992Recorded: 01/02/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/23/2001
Exec Dt:
08/23/2001
Assignee:
7-1, SHIBA 5-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
HAYES, SOLOWAY, HENNESSEY, ET AL
NORMAN P. SOLOWAY
175 CANAL STREET
MANCHESTER, NH 03101
Assignment: 3
Reel/Frame:
013736/0321Recorded: 02/19/2003Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/01/2002
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI
KANAGAWA 211-8668, JAPAN
Correspondent:
HAYES SOLSOWAY P.C.
NORMAN P. SOLOWAY
130 W. CUSHING STREET
TUCSON, AZ 85701

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