Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10243972
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Filing Dt:
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09/12/2002
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Publication #:
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Pub Dt:
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06/12/2003
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Inventors:
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Ubaldo Mastromatteo, Mauro Bombonati, Daniela Morin, Marta Mottura, Mauro Marchi
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Title:
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Process for bonding and electrically connecting microsystems integrated in several distinct substrates
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| VIA C. OLIVETTI, 2 |
| I-20041 AGRATE BRIANZA, ITALY |
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| SEED INTELLECTUAL PROPERTY LAW GRP PLLC |
| HAROLD H. BENNETT II |
| 701 FIFTH AVENUE |
| SUITE 6300 |
| SEATTLE, WA 98104-7092 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO ADD ASSIGNEE NAME, PREVIOUSLY RECORDED ON REEL 013651 FRAME 0959.
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| VIA C. OLIVETTI, 2 |
| I-20041 AGRATE BRIANZA, ITALY |
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| 11413 CHINDEN BOULEVARD |
| BOISE, IDAHO 83714 |
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| SEED INTELLECTUAL PROPERTY ET AL. |
| HAROLD H. BENNETT II |
| 701 FIFTH AVENUE, SUITE 6300 |
| SEATTLE, WA 98104-7092 |
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