Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10243972
|
Filing Dt:
|
09/12/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/12/2003
| | | | |
|
Inventors:
|
Ubaldo Mastromatteo, Mauro Bombonati, Daniela Morin, Marta Mottura, Mauro Marchi
|
|
Title:
|
Process for bonding and electrically connecting microsystems integrated in several distinct substrates
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| VIA C. OLIVETTI, 2 |
| I-20041 AGRATE BRIANZA, ITALY |
|
|
|
|
| SEED INTELLECTUAL PROPERTY LAW GRP PLLC |
| HAROLD H. BENNETT II |
| 701 FIFTH AVENUE |
| SUITE 6300 |
| SEATTLE, WA 98104-7092 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
CORRECTIVE ASSIGNMENT TO ADD ASSIGNEE NAME, PREVIOUSLY RECORDED ON REEL 013651 FRAME 0959.
|
|
|
|
|
|
|
|
|
| VIA C. OLIVETTI, 2 |
| I-20041 AGRATE BRIANZA, ITALY |
|
|
|
| 11413 CHINDEN BOULEVARD |
| BOISE, IDAHO 83714 |
|
|
|
|
| SEED INTELLECTUAL PROPERTY ET AL. |
| HAROLD H. BENNETT II |
| 701 FIFTH AVENUE, SUITE 6300 |
| SEATTLE, WA 98104-7092 |
|
|
Search Results as of:
06/27/2024 04:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
