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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10023128
Filing Dt:
12/18/2001
Publication #:
Pub Dt:
06/19/2003
Inventors:
Chee Seng Foong, Cheng Choi Yong, Lan Chu Tan, Ruzaini Bin Ibrahim
Title:
Stacked die semiconductor device
Assignment: 1
Reel/Frame:
012727/0469Recorded: 03/05/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/21/2001
Exec Dt:
11/21/2001
Exec Dt:
11/21/2001
Exec Dt:
11/21/2001
Assignee:
LAW DEPARTMENT
1303 EAST ALGONQUIN ROAD
SCHAUMBURG, ILLINOIS 60196
Correspondent:
MOTOROLA, INC.
MARK FINK
3102 NORTH 56TH STREET
MAILDROP 56-238
PHOENIX, AZ 85018

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