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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10017149
Filing Dt:
12/14/2001
Publication #:
Pub Dt:
06/19/2003
Inventors:
Xian J. Ning, Yi-Sheng Hsieh
Title:
Stacked metal-insulator-metal capacitor structures in between interconnection layers
Assignment: 1
Reel/Frame:
012808/0719Recorded: 04/12/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/15/2001
Exec Dt:
12/15/2001
Assignee:
993 HIGHLAND CIRCLE
LOS ALTOS, CALIFORNIA 94024
Correspondent:
HOGAN & HARTSON LLP
ANTHONY J. ORLER ESQ
500 SOUTH GRAND AVENUE SUITE 1900
LOS ANGELES, CA 90071

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