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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10321755
Filing Dt:
12/17/2002
Publication #:
Pub Dt:
06/19/2003
Inventors:
Hyun-jin Jang, Jong-yoon Yoon
Title:
Method for forming metal wire of semiconductor device
Assignment: 1
Reel/Frame:
013860/0574Recorded: 03/19/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/13/2002
Exec Dt:
11/13/2002
Assignee:
SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SHI
GYUNGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MICHAEL R. HULL
233 S. WACKER DRIVE
6300 SEARS TOWER
CHICAGO, IL 60606-6357

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