Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/17/2005
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Application #:
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10278645
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Filing Dt:
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10/23/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Inventors:
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Sang-Kyum Kim, Chang-Hee Choi
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Title:
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ELECTRODEPOSITED COPPER FOIL FOR PCB HAVING BARRIER LAYER OF ZN-CO-AS ALLOY AND SURFACE TREATMENT METHOD OF THE COPPER FOIL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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20, YOIDO-DONG, YOUNGDUNGPO-GU |
SEOUL 150-875, KOREA, REPUBLIC OF |
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CANTOR COLBURN LLP |
DANIEL F. DREXLER |
55 GRIFFIN ROAD SOUTH |
BLOOMFIELD, CT 06002 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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#159, SAMSEONG-DONG, GANGNAM-GU |
SEOUL, KOREA, REPUBLIC OF |
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JONES DAY |
222 EAST 41ST STREET |
NEW YORK CITY, NY 10017-6702 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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#1026-6 HOGYE-DONG, DONG-AN-GU, ANYANG-CITY |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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JONES DAY |
222 EAST 41ST STREET |
NEW YORK CITY, NY 10017-6702 |
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