Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/25/2003
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Application #:
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10321427
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Filing Dt:
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12/18/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Inventors:
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Moon Bong Ahn, Chan Wang Park, Yong Chil Choi
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Title:
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CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN-3-DONG, PALDAL-KU |
| SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF |
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| LOWE HAUPTMAN GILMAN & BERNER |
| BENJAMIN J. HAUPTMAN |
| STE. 300, 1700 DIAGONAL RD. |
| ALEXANDRIA, VA 22314 |
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