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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10038714
Filing Dt:
01/02/2002
Publication #:
Pub Dt:
07/03/2003
Inventors:
Shibaek Nam, Oseob Jeon, Chulho Heo
Title:
Semiconductor device having multi-chip package structure
Assignment: 1
Reel/Frame:
012460/0298Recorded: 01/02/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/21/2001
Exec Dt:
12/21/2001
Exec Dt:
12/21/2001
Assignee:
82 RUNNING HILL ROAD
SOUTH PORTLAND, MAINE 04106
Correspondent:
SKJERVEN MORRILL MACPHERSON LLP
PHILIP W. WOO
THREE EMBARCADERO, SUITE 2800
SAN FRANCISCO, CALIFORNIA 94111
Assignment: 2
Reel/Frame:
057694/0374Recorded: 08/03/2021Pages: 381
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/22/2021
Assignee:
5005 E. MCDOWELL ROAD, MD A700
PHOENIX, ARIZONA 85008
Correspondent:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MD A700
PHOENIX, AZ 85008

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