Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/19/2008
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Application #:
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10236120
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Filing Dt:
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09/06/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Inventors:
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Brian L. Webb, Jinlin Peng, Michael D. Brady, Mircea Despa, Keith A. Horn, Po Ki Yuen et al
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Title:
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MICROCOLUMN-PLATFORM BASED ARRAY FOR HIGH-THROUGHPUT ANALYSIS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PATENT DEPT.; SP-TI-03-1 |
| CORNING, NEW YORK 14831 |
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| CORNING INCORPORATED |
| VINCENT T. KUNG |
| PATENT DEPARTMENT |
| SP-TI-03-1 |
| CORNING, NY 14831 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PATENT DEPT.; SP-TI-03-1 |
| CORNING, NEW YORK 14831 |
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| JOANNE N. PAPPAS |
| CORNING INCORPORATED |
| PATENT DEPARTMENT |
| SP-TI-03-1 |
| CORNING, NEW YORK 14831 |
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