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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10281386
Filing Dt:
10/25/2002
Publication #:
Pub Dt:
07/03/2003
Inventors:
Ling Chen, Hua Chung, Sean M. Seutter, Michael X. Yang, Ming Xi, Vincent Ku, Dien-Yeh Wu et al
Title:
Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application
Assignment: 1
Reel/Frame:
013833/0571Recorded: 03/06/2003Pages: 35
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/27/2003
Exec Dt:
01/24/2003
Exec Dt:
02/03/2003
Exec Dt:
02/04/2003
Exec Dt:
02/05/2003
Exec Dt:
01/24/2003
Exec Dt:
01/28/2003
Exec Dt:
01/27/2003
Exec Dt:
01/24/2003
Exec Dt:
01/27/2003
Exec Dt:
01/24/2003
Assignee:
P.O. BOX 450-A
SANTA CLARA, CALIFORNIA 95052
Correspondent:
APPLIED MATERIALS INC.
PATENT COUNSEL
PETER J. SGARBOSSA
P.O. BOX 450-A
SANTA CLARA, CA 95052

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