Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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10331070
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Filing Dt:
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12/27/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Inventors:
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Noriko Miyairi, Yasuo Inada, Tsuyoshi Hasegawa, Takahiro Umeda, Yuji Terashima et al
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Title:
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METHOD OF POLISHING COPPER LAYER OF SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1650 KIYONO, MATSUSHIRO-MACHI |
| NAGANO-SHI, NAGANO, JAPAN 381-1233 |
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| 1-1 CHIRYO 2-CHOME, NISHIBIWAJIMA-CHO |
| NISHIKASUGAI-GUN, AICHI, JAPAN 452-8502 |
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| JORDAN AND HAMBURG LLP |
| C. BRUCE HAMBURG, ESQ. |
| 122 EAST 42ND STREET |
| CHANIN BUILDING,SUITE 4000 |
| NEW YORK, NY 10168 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1650, KIYONO, MATSUSHIRO-MACHI |
| NAGANO-SHI, NAGANO, 381-1233, JAPAN |
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| C. BRUCE HAMBURG, ESQ. |
| JORDAN AND HAMBURG LLP |
| CHANIN BUILDING, SUITE 4000 |
| 122 EAST 42ND STREET |
| NEW YORK, NEW YORK 10168 |
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