Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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10207027
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Filing Dt:
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07/30/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Inventors:
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Toshihisa Hara, Yasuhiro Shintani, Masayasu Nishimura, Ryoichi Ozaki et al
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Title:
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PLATED COPPER ALLOY MATERIAL AND PROCESS FOR PRODUCTION THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-26, WAKINOHAMA-CHO 2-CHOME, CHUO-KU |
| KOBE-SHI, HYOGO 651-8585, JAPAN |
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| OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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