Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10351667
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Filing Dt:
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01/27/2003
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Publication #:
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Pub Dt:
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07/31/2003
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Inventors:
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Chih-Hsiang Hsu, Shih-Kuang Chen, Chia-Hung Cheng, Min-Lung Huang
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Title:
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Under bump structure and process for producing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD ROAD |
| NANTZE EXPORT PROCESSING ZONE KAOSHIUNG |
| KAOSHIUNG, TAIWAN R.O.C. |
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| SEYFARTH SHAW |
| HAROLD V. STOTTLAND |
| SUITE 4200 |
| 55 EAST MONROE STREET |
| CHICAGO, IL 60603-5803 |
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