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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/29/2003
Application #:
10066422
Filing Dt:
01/31/2002
Publication #:
Pub Dt:
07/31/2003
Inventors:
Anthony M. Chiu, Harry Michael Siegel
Title:
SYSTEM AND METHOD FOR PROVIDING MECHANICAL PLANARIZATION OF A SEQUENTIAL BUILD UP SUBSTRATE FOR AN INTEGRATED CIRCUIT PACKAGE
Assignment: 1
Reel/Frame:
012561/0046Recorded: 01/31/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/30/2002
Exec Dt:
01/30/2002
Assignee:
1310 ELECTRONICS DRIVE
CARROLLTON, TEXAS 75006
Correspondent:
STMICROELECTRONICS, INC.
LISA K. JORGENSON
1310 ELECTRONICS DRIVE
MS 2346
CARROLLTON, TX 75006

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