Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10343519
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Filing Dt:
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01/30/2003
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Publication #:
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Pub Dt:
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07/31/2003
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Inventors:
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Kyung-Wook Paik, Myung-Jin Yim
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Title:
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HIGH RELIABILITY NON-CONDUCTIVE ADHESIVES FOR NON-SOLDER FLIP CHIP BONDINGS AND FLIP CHIP BONDING METHOD USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 373-1 KUSONG-DONG, YUSONG-GU |
| TAEJON 305-701, KOREA, REPUBLIC OF |
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| #401 YOUNGDO CAPITAL BLDG., 218-1 OKSU-DONG, SUNGDONG-KU |
| SEOUL 133-839, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| HOSOON LEE |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OR 97205 |
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