Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10059404
|
Filing Dt:
|
01/31/2002
|
Publication #:
|
|
Pub Dt:
|
07/31/2003
| | | | |
Inventors:
|
Mikel R. Fulk, Jason M. Key, Jack A. Bednarz, Daniel A. Lawlyes
|
Title:
|
High density wire bondable connector assembly
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
P.O. BOX 5052 |
LEGAL STAFF - MAIL CODE : 480-414-420 |
TROY, MICHIGAN |
|
|
|
DELPHI TECHNOLOGIES, INC. |
JIMMY L. FUNKE |
P.O. BOX 9004 |
LEGAL STAFF, MAIL CODE: A-107 |
KOKOMO, IN 46904-9005 |
|
|
Search Results as of:
06/01/2024 12:05 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|