Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10372546
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Filing Dt:
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02/21/2003
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Publication #:
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Pub Dt:
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08/21/2003
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Inventors:
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Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Yung-Chi Lee, Min-Lung Huang, Jau-Shoung Chen et al
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Title:
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Process of fabricating bumps
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD. RD., 811, NANTZE |
| EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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| J. C. PATENTS, INC. |
| JIAWEI HUANG |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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