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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/19/2005
Application #:
10387754
Filing Dt:
03/13/2003
Publication #:
Pub Dt:
08/28/2003
Inventors:
Shiuh-Hui Steven Chen, Raymond Garza, Carl Ross, Stefan Turalski
Title:
SEMICONDUCTOR WAFER HAVING A THIN DIE AND TETHERS AND METHODS OF MAKING THE SAME
Assignment: 1
Reel/Frame:
018471/0170Recorded: 10/31/2006Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/16/2006
Assignee:
21440 WEST LAKE COOK ROAD, 7TH FLOOR
PATENTS & LICENSES
DEER PARK, ILLINOIS 60010
Correspondent:
CONTINANTAL AUTOMOTIVE SYSTEMS
TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
GARY J. CUNNINGHAM
21440 WEST LAKE COOK ROAD, 7TH FLOOR
DEER PARK, IL 60010

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