Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10331360
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Filing Dt:
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12/30/2002
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Publication #:
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Pub Dt:
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09/04/2003
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Inventors:
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Ki Cheol Ahn, Pan Ki Kwon, Jong Goo Jung, Sang Ick Lee
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Title:
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CMP slurry for metal and method for manufacturing metal line contact plug of semiconductor device using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF 467-860 |
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| MARSHALL, GERSTEIN & BORUN |
| MICHAEL R. HULL |
| 233 S. WACKER DRIVE, SUITE 6300 |
| SEARS TOWER |
| CHICAGO, ILLINOIS 60606-6357 |
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