Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/13/2004
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Application #:
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10093995
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Filing Dt:
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03/06/2002
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Publication #:
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Pub Dt:
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09/11/2003
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Inventors:
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Cheng-Yuan Lin, Sheng-Long Wu, Te-Chang Huang, Hao-Wei Liang, Pin-Hsuan Chang
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Title:
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SOLDER PASTE STENCILING APPARATUS FOR MINIMIZING RESIDUE OF SOLDER PASTE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 91, LANE 814, TA-HSIN RD. SHIN CHUANG VILLAGE |
| LU CHU HSIANG, TAOYUAN HSIEN, TAIWAN R.O.C |
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| DELLETT AND WALTERS |
| JAMES H. WALTERS |
| 310 S.W. FOURTH AVENUE, SUITE 1101 |
| PORTLAND, OR 97204 |
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