Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10113016
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Filing Dt:
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03/28/2002
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Publication #:
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Pub Dt:
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10/02/2003
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Inventors:
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Johanna M. Swan, Bala Natarajan, Chien Chiang, Valluri R. Rao, Greg Atwood
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Title:
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Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP |
| STEPHEN M. DE KLERK |
| 12400 WILSHIRE BOULEVARD, 7TH FLOOR |
| LOS ANGELES, CA 90025 |
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