Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10418204
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Filing Dt:
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04/18/2003
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Publication #:
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Pub Dt:
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10/23/2003
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Inventors:
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Yasufumi Shirakawa, Masaki Taniguchi, Hideo Fukuda, Yuzo Shimizu, Shinya Esaki
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Title:
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Integrated circuit device packaging structure and packaging method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZZ KADOMA |
| KADOMA-SHI |
| OSAKA 571-8501, JAPAN |
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| MCDERMOTT WILL & EMERY |
| MICHAEL E. FOGARTY |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1006 OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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| KENJI KAMATA |
| 1130 CONNECTICUT AVE., N.W., SUITE 1100 |
| PANASONIC PATENT CENTER |
| WASHINGTON, DC 20036 |
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