Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/08/2004
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Application #:
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10318529
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Filing Dt:
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12/13/2002
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Publication #:
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Pub Dt:
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10/23/2003
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Inventor:
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Thorsten Pannek
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Title:
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METHOD OF REDUCING THE THICKNESS OF A SILICON SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| POSTFACH 30 02 20 |
| STUTTGART, GERMANY D-70442 |
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| KENYON & KENYON |
| RICHARD L. MAYER |
| ONE BROADWAY |
| NEW YORK, NY 10004 |
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